cEDM WORKSHOP # 23

When developing a new product, an electronics designer is faced with a lot of risks to take into account, from the point of view of functionality, performance, design, manufacturability and reliability of the Hardware.
cEDM has developed several analysis tools that allow to estimate product reliability risks, help to mitigate the issues, and propose good design practices. In this way, the designer contributes to an efficient manufacturing and a low risk new product introduction.
The toolbox consists of :

• NPI : New Product Introduction methodology and Questionnaire, creating a comprehensive understanding of PCB/PBA requirements for the multifunctional project team.
• Failure and reliability risk analysis using an FMEA (Failure Mode Effect Analysis) methodology.
• BOM based prediction of production quality, test coverage, and assembly cost.
• Methods for thermal, thermo-mechanical and electrical simulation.
• Design for Manufacturing analysis based on DFM guidelines.
• Qualification methods for components, PCB supply and PBA manufacturing.

The cEDM team will provide an overview of the different risk analysis methodologies, and will focus on 3 specific methods. Practical examples to clarify the method and the outcome of the analysis will be presented.
After the workshop, participants will receive the Failure Risk Assessment table in electronic and poster format. This table can be used as a checklist for your project.

 Workshop 23