Green IC Packaging


Public, Members and Partners


The last decade new electronic materials are being introduced by component, PCB manufacturers and assembly plants to cope with the IC-technology evolution, the environmental legislation (RoHS) and the “going green” trend. One of these trends has been the replacement of the mold compound of plastic packaged IC-components by so-called “Green Mold Compounds” (GMC) which are usually halogen-free, hence the name. The change-over has gradually taken place in the last five years and has reached a very high penetration level without being noticed by most of the component users. Although these new mold compounds have many environmental and technical benefits, they also may endanger the reliability of electronics significantly. Product lifetime may be divided by a factor four when GMC based components are introduced. The workshop will explain the risks that GMC based IC-packages pose to - especially professional - electronics as well as the parameters of influence.

 Workshop 12

Members and partners can download the presentations of workshop 12 here.
Friday, November 25, 2011
  • 13h30 Doors
  • 14h00 Welcome: The Electronic Design & Manufacturing program (Geert Willems - imec - EDM)
  • 14h10 Green IC packaging: electronics reliability imperiled? (Geert Willems - imec - EDM)
  • 14h40 Mold compounds: what is it all about? (Makino Tatsuya - Hitachi Chemical Co Ltd)
  • 15h00 Pause
  • 15h30 Reliability impact assessment of Green Mold Compounds (Bart Vandevelde - imec)
  • 16h15 Q&A - Discussion
  • 16h45 Networking with drinks and snacks

Send an e-mail to training@imec.be


imec, Kapeldreef 75, 3001 Heverlee

Participation fee: 
  • cEDM Member: free
  • cEDM Partner: free
  • IMAPS Benelux Autumn event participants: free
  • Others: € 80