New standard releases:IPC-A-610J & J-STD-001J

IPC J-STD-005BRequirements for Solder Pastes - Released April 2024

IPC J-STD-004DRequirements for Soldering Fluxes - Released April 2024

IPC J-STD-001JRequirements for Soldered Electrical and Electronic Assemblies - Released April 2024

IPC-A-610JAcceptability for Electronic Assemblies - Released April 2024

IPC-4922Requirements for Sintering Materials for Electrical and Thermal Interconnects - Released April 2024

IPC-4562BSpecification for Metal Base Copper Clad Laminates for Printed Boards - Released April 2024

IPC-4413Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards - Released April 2024

IPC-7711/21DRework, Modification and Repair of Electronic Assemblies - Released January 2024

IPC-2221CGeneric Standard on Printed Board Design - Released January 2024

IPC-1791DTrusted Electronic Designer, Fabricator and Assembler Requirements - Released January 2024

IPC-1782B, Standard for Manufacturing and Supply Chain Traceability of Electronic Products - Released January 2024

IPC-2591 V1.7Connected Factory Exchange - Released October 2023

IPC-6012FQualification and Performance Specification for Rigid Printed Boards - Released October 2023

IPC-7352Generic Guideline for Land Pattern Design - Released July 2023

IPC-997APress-fit Standard for Automotive Requirements and other High-Reliability Applications - Released July 2023

IPC-2591 V1.6, Connected Factory Exchange (CFX) - Released March 2023

IPC-1791C, Trusted Electronic Designer Fabricator and Assembler Requirements - Released March 2023

IPC-1792Standard for the Management and Mitigation of Cybersecurity Incidents in the Manufacturing Industry Supply Chain - Released February 2023

IPC-7091ADesign and Assembly Process Implementation of 3D Components - Released February 2023

IPC-8971, Requirements for Electrical Testing of Printed Electronics E-Textiles - Released February 2023

IPC-8952Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles - Released February 2023

IPC-9203AMaterial and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance Using the IPC-B-52 Test Assembly - Released February 2023

IPC J-STD-003DSolderability Tests for Printed Boards - Released February 2023

IPC J-STD-004C WAM1Requirements for Soldering Fluxes - Released February 2023

IPC/JEDEC J-STD-020FMoisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs) - Released February 2023

IPC/JEDEC J-STD-035AAcoustic Microscopy for Nonhermetic Encapsulated Electronics Devices - Released February 2023

IPC-1402Standard for Greener Cleaners Used in Electronic Manufacturing - Released December 2022

IPC-2292ADesign Standard for Printed Electronics on Flexible Substrates - Released December 2022

IPC-7092A, Design and Assembly Process Implementation for Embedded Circuitry - Released December 2022

IPC-2228Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards - Released October 2022

IPC-4592Requirements for Printed Electronics Functional Dielectric Materials - Released October 2022

IPC-5262Design, Critical Process and Acceptance Requirements for Polymeric Applications - Released October 2022

IPC-7801AReflow Oven Process Control Standard - Released October 2022

IPC/WHMA-A-620ERequirements and Acceptance for Cable and Wire Harness Assemblies - Released October 2022

IPC J-STD-004CRequirements for Soldering Fluxes - Released March 2022



IPC-6018DQualification and Performance Specification for High Frequency (Microwave) Printed Boards - Released March 2022

IPC-7525C Stencil Design Guidelines - Released March 2022

IPC-D-620ADesign and Critical Process Requirements for Cable and Wiring Harnesses - Released March 2022

IPC-2591 v1.4Connected Factory Exchange - Released January 2022

IPC-1401ACorporate Social Responsibility Management System Standard - Released November 2021

IPC-9709AGuidelines for Acoustic Emission Measurement Method During Mechanical Testing - Released November 2021

IPC-T-50N, Terms and Definitions for Interconnecting and Packaging Electronic Circuits - released November 2021

IPC-1791BTrusted Electronic Designer, Fabricator and Assembler Requirements - Released October 2021

IPC-6013EQualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards - Released October 2021

IPC-6017AQualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry - Released October 2021

IPC-4552BSpecification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards - Released August 2021