New standard releases

IPC-1402Standard for Greener Cleaners Used in Electronic Manufacturing - Released December 2022

IPC-2292ADesign Standard for Printed Electronics on Flexible Substrates - Released December 2022

IPC-7092A, Design and Assembly Process Implementation for Embedded Circuitry - Released December 2022

IPC-2228Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards - Released October 2022

IPC-4592Requirements for Printed Electronics Functional Dielectric Materials - Released October 2022

IPC-5262Design, Critical Process and Acceptance Requirements for Polymeric Applications - Released October 2022

IPC-7801AReflow Oven Process Control Standard - Released October 2022

IPC/WHMA-A-620ERequirements and Acceptance for Cable and Wire Harness Assemblies - Released October 2022

IPC J-STD-004CRequirements for Soldering Fluxes - Released March 2022

IPC-4202CSPECIFICATION FOR FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS - Released March 2022

IPC-4412CSPECIFICATION FOR FINISHED FABRIC WOVEN FROM "E" GLASS FOR PRINTED BOARDS - Released March 2022

IPC-6018DQualification and Performance Specification for High Frequency (Microwave) Printed Boards - Released March 2022

IPC-7525C Stencil Design Guidelines - Released March 2022

IPC-D-620ADesign and Critical Process Requirements for Cable and Wiring Harnesses - Released March 2022

IPC-2591 v1.4Connected Factory Exchange - Released January 2022

IPC-1401ACorporate Social Responsibility Management System Standard - Released November 2021

IPC-9709AGuidelines for Acoustic Emission Measurement Method During Mechanical Testing - Released November 2021

IPC-T-50N, Terms and Definitions for Interconnecting and Packaging Electronic Circuits - released November 2021

IPC-1791BTrusted Electronic Designer, Fabricator and Assembler Requirements - Released October 2021

IPC-6013EQualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards - Released October 2021

IPC-6017AQualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry - Released October 2021

IPC-4552BSpecification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards - Released August 2021