Electronics Cooling and Interconnect Technologies

for Vehicle Computers

Tuesday, May 18, 2021
  • Introduction: HIPER: Introduction to collaborative research project on High Performance Vehicle Processors
  • Presentation 1: Advanced 3D printing solutions for advanced processor cooling
  • Presentation 2 Part A: 3D printing technology
  • Presentation 2 Part B: Simulation and characterisation of cooling performance of 3D printed heat sink
  • Presentation 3: Low melting point solder technology for advanced processor components

Towards an Improved Lifetime Prediction of Electronics

Friday, January 10, 2020
  • Introduction
  • Presentation 1: Reliability by design approach for life time prediction of electronic systems
  • Presentation 2: Challenging the acceleration factor models by a Long-Term life Testing on a soldered board assembly
  • Presentation 3: Engineering model for the life prediction of LED drivers
  • Presentation 4: Design-for-Robustness for electronics
  • Video of workshop


Space Electronics for the 21st Century


Thursday, June 13, 2019
  • Presentation 1: Introduction to Space Electronics for the 21st Century
  • Presentation 2: Improving Space Electronics: a review of opportunities
  • Presentation 3: Electronics for earth orbit satellite missions: Proba-V
  • Presentation 4: Life Cycle Assessment and eco-design of the PROBA-V space mission: focus on space electronics
  • Presentation 5: High-density Printed Circuit Boards for Space Electronics
  • The ESA and Verhaert presentations were cancelled because of last-minute unavailability of the speakers.

Smart New Product Introduction

Wednesday, November 7, 2018
  •  Presentation1: Predictive New Product Introduction for Smart Products
  •  Presentation2: New Product Introduction Process in a Startup Company
  •  Presentation3: Think before you act, leads to “right first time”
  •  Presentation4: World Wide NPI: the PBA Passport opens the manufacturing doors
  •  Presentation5: The Smart Product Initiative

Flexible Electronics

Wednesday, May 23, 2018
  •  Presentation1: Advantages and challenges of flex-rigid PCB technology
  •  Presentation2: Challenges in design and assembly using flex substrates
  •  Presentation3: Challenges and opportunities in printed electronics manufacturing
  •  Presentation4: Stretchable circuits

Reliable Electronics for Aerospace

Thursday, January 18, 2018
  •  Presentation1: Challenges of segmented supply chains in component qualification for space
  •  Presentation2: Automatization for large solar panels assembly
  •  Presentation3: Reliable electronics for aerospace
  •  Presentation4: Aluminum silicon carbide
  •  Presentation5: Contribution of multiphysics simulation to reliable microsystem packaging

How autonomous and electric cars push the need for more reliable electronics

Friday, September 22, 2017

Members and partners can download the presentations of workshop 27 here.

  •  Intro
  •  Presentation1: Next Generation Approaches for Reliability of Automotive Smart Systems
  •  Presentation2: Automotive electronic components qualification standards and guidelines: update of the current status
  •  Presentation3: Challenges for future connected and automated cars
  •  Presentation4: Improving the reliability of electronic systems using potting
  •  Presentation5: cEDM’s DfR for automotive electronics: experiences and strategy

Merging of Textiles and Electronics

Friday, June 9, 2017

Members and partners can download the presentations of workshop 26 here.

  •  Intro
  •  Presentation1: The CareWare project: different industries working together on smart textiles
  •  Presentation2: Smart Wearables
  •  Presentation3: Integration of electronincs on textiles by means of coating, lamination, adhesives or embedding
  •  Presentation4: Electrical interconnections for electronics and textiles

Friday, September 30, 2016
Members and partners can download the presentations of workshop 25 here.
  •  Intro
  •  Presentation1: The future of RoHS: What is still coming up
  •  Presentation2: 10 years of RoHS and future challenges and trends in soldering chemistry
  •  Presentation3: Conductive adhesives as alternative for solder
    Due to confidentiality reason, full presentation is not available. Please contact for further details and a copy of the original presentation.
  •  Presentation4: Lead free soldering: a challenge for PCB base materials

Reliability of Electronics

A selection of topics

Friday, May 27, 2016
Members and partners can download the presentations of workshop 24 here.
  •  Intro
  •  Presentation1: Results from the cEDM research projects
  •  Presentation2: Thermal Integration Guideline
  •  Presentation3: Avoiding Common Failure Causes - A Practical Overview
  •  Presentation4: Reliability and robustness importance of power electronics for the wind power industry