Printed Board Assembly Design-for-X Guidelines

The PBA DfX Guidelines provide practical guidelines to master the multi-disciplinary hardware aspects of electronic module (PBA) development.

DfX
Guideline
Title Status Partners Members Public
EDM-D-000 Good Design-for-X Practice (V2.0) released free
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EDM-D-001 PCB Specification (V3.0)
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EDM-D-002 Component Specification (V1.3)
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EDM-D-003 PBA Assembly Material Specification (V1.3)
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EDM-D-004 Design-for-Assembly (V1.1)
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EDM-D-005 Rigid PCB Build-Up and Density Classification (V1.5)
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EDM-D-006 Layout Solutions (V1.2)
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EDM-D-007 Quality and Test Coverage Quantification
Design-for-Test (V1.3)
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EDM-D-008 Technology and Manufacturing Capability Mapping of PBA designs (V1.2)
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EDM-D-009 Signal Integrity (V1.0)
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EDM-D-010 Power Integrity (V1.0)
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EDM-D-011 Electro-Magnetic Compatibility (V1.0)
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EDM-D-012 Mechanical Integration (V1.0)
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EDM-D-013 Thermal design of electronics (V1.0)
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EDM-D-100 Reliability Quantification (V1.1)
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Use and implementation of cEDM DfX Guidelines

DfX
Guideline
OEM, Design and industrialisation EMS and in-house assembly PCB manufacturer
EDM-D-000 General design guidelines: high level design deployable in conceptual design phase. Good DfX practice reference for communication with customers. Background knowledge. Good DfX practice reference for communication with customers. Background knowledge.
EDM-D-001

Design and purchasing instructions for PCB laminate Implementation: design rules, purchasing instructions

  • Lead-free compatibility of PCB
  • Design-for-reliability of PCB (via fatigue)
  • PCB Quality/performance requirements
  • Solderable finish selection

Purchasing instructions for PCB

  • Lead-free compatibility of PCB
  • Design-for-reliability of PCB (via fatigue)
  • PCB Quality/performance requirements
  • Solderable finish selection

Assemby preparation and handling

  • Moisture management of PCB: storage and drying
  • Packing PCB for storage
  • PCB damage prevention in assembly and repair

Purchasing instructions for PCB laminate, customer information.

  • Lead-free compatibility of PCB
  • Design-for-reliability of PCB (via fatigue)
  • Solderable finish

Assemby preparation and handling

  • Moisture management of PCB: storage and drying
  • Packing PCB for storage
EDM-D-002

Design and purchasing instructions for components.
Implementation: Approved Components and Manufacturer's List(s)

  • Lead-free compatibility of BOM
  • Design-for-Reliability of PBA (solder joint, SIR, whisker,... )
  • Component Quality/performance requirements
  • Terminal finish selection
  • Design-for-Assembly: component aspects
  • MSL (J-STD-020/J-STD-075) and PSL definition and use for process compatibility

Purchasing instructions for components
Implementation: Approved Components and Manufacturers List(s)

  • Lead-free compatibility of BOM
  • Assessment of eliability risk of PBA (solder joint, SIR, whisker,... ): liability risks of EMS, customer feedback
  • Component Quality/performance requirements
  • Terminal finish selection
  • Assembly preparation and handling
  • Moisture management of components: storage and drying.
  • J-STD-020/J-STD-075.
  • Reflow profile and wave soldering process set-up
  • BOM damage prevention: check for lead-free soldering incompatibility, soldering/cleaning limitations. PSL (J-STD-075)
  • inspection instructions
Background info
EDM-D-003

Design (material selection, design-for-cleaning) and assembly instructions
Implementation: Design rules, Assembly instructions

  • RoHS, SnPb, lead-free alloy selection
  • Design-for-Reliability of PBA (alloy selection,mixed alloys, SIR, thermal mismatch)
  • Assembly material quality/performance requirements

Assembly material selection, qualification and handling
Implementation: Qualification, Purchasing, Process and production floor management instructions

  • RoHS, SnPb, lead-free alloy selection
  • Reliability risk mitigation of PBA (alloy selection,mixed alloys, SIR, thermal mismatch): select safe materials even if they "solder not as well".
  • Assembly material quality/performance requirements
  • Assembly material storage and handling.
Background info
EDM-D-004

Design rules and assembly plant selection and instructions
Implementation: design rules, PBA passport, NPI release, EMS purchasing instructions

  • Automatic machine handling
  • Selection of PBA build-up and associated assembly flow
  • BOM compatibility with assembly processes
  • Component placement
  • Repair

Assembly preparation
Implementation: Assembly preparation instructions , methods and tools.

  • Identification of assembly flow
  • BOM & layout process compatibility check
  • Reflow profile and wave soldering process set-up
  • Component collection, machine assignment,...
  • Assembly cost estimation
Background info
EDM-D-005

Design rules and PCB plant selection and instructions
Implementation: design rules, PBA passport, NPI release, PCB purchasing instructions.

  • PCB build-up
  • Selecting optimal PCB density
  • class: minimization of cost and complexity.
  • Cu thickness
  • Selecting design matched PCB supplier using density classes.
  • Criteria for selecting advanced PCB technologies
  • Quality and reliability risks of advanced technologies
  • PCB build-up nomenclature

PCB plant selection and instructions
Implementation: PBA passport, PCB purchasing instructions.

  • Selecting design matched PCB supplier using density classes.
  • Quality and reliability risks of advanced PCB technologies: risk assessment.
  • PCB build-up nomenclature
  • Input for solder process and repair set-up

PCB manufacturing capabilities, customer support
Implementation: nomenclature, technical capacity identification.

  • Communication of technical capabilities
  • Quality and reliability risk assessment and related customer communication
EDM-D-006

Layout rules
Implementation: footprint library, layout rules, design checks

  • Footprint design basics for BGA, QFN,...
  • Thermal relief
Design check
Implementation: DfM check
Design check
Implementation: DfM check
EDM-D-007

Assembly risk assessment, quality and yield prediction, Design-for-Test.
Implementation: Test strategy development instructions, DfM/DfT evaluation, NPI release

  • Quality quantification methodology
  • Test coverage quantification
  • Test strategy development basics
  • DfT guidelines for production test and inspection
  • Quality, Test and Non-quality cost prediction

Assembly risk assessment, quality and yield prediction, Test strategy set-up.
Implementation: Test strategy development instructions, manufacturability and testability assessment, cost estimation method

  • Quality quantification methodology
  • Test coverage quantification
  • Test strategy development basics
  • Quality, Test and Non-quality cost prediction
  • Customer communication and quotation
Background info
EDM-D-008
  • Identification of technology, manufacturing and test capability needs for PCB and PBA: PBA Passport.
  • Design-for-X evaluation.
  • Cost, quality, reliability and supply risk assessment.
  • PCB supplier selection and qualification.
  • PBA assembly selection and evaluation.
  • Assembly capability mapping.
  • PBA design assembly analysis and quotation.
  • Assembly preparation.
  • Customer communication.
  • PCB manufacturing capability mapping.
  • PCB manufacturing analysis and quotation.
  • Manufacturing preparation.
  • Customer communication.
EDM-D-009 Design guidelines to guarantee signal integrity on PBA. Background info Clarification of PCB layout
EDM-D-010 Design guidelines to guarantee power integrity on PBA. Background info Clarification of PCB layout
EDM-D-011 Design guideline to guarantee Electro-Magnetic Compatibility in a system. Background info Clarification of PCB layout
EDM-D-012
  • Understanding impact of vibration and PBA fixation on PBA reliability.
  • Vibration load assessment
  • Guidelines for pre-layout fixation point and stiffner location
Background info Background info
EDM-D-013 Thermal design of PBA in a system. Clarification of PBA build-up: heat sinks Clarification of PBA build-up: heat sinks
EDM-D-100 Reliability quantification, assessment and lifetime prediction. Basis of reliability risk assessment of delivered products. Assessment of stress screening (e.g. burn-in) relevancy.  Background info