Printed Board Assembly Design-for-X Guidelines

The PBA DfX Guidelines provide practical guidelines to master the multi-disciplinary hardware aspects of electronic module (PBA) development.

DfX
Guideline
Title Status Partners Members Public
EDM-D-000 Good Design-for-X Practice (V2.0) released free
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EDM-D-001 PCB Specification (V3.0)
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EDM-D-002 Component Specification (V1.3)
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EDM-D-003 PBA Assembly Material Specification (V1.3)
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EDM-D-004 Design-for-Assembly (V1.1)
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EDM-D-005 Rigid PCB Build-Up and Density Classification (V1.5)
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EDM-D-006 Layout Solutions (V1.2)
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EDM-D-007 Quality and Test Coverage Quantification
Design-for-Test (V1.3)
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EDM-D-008 Technology and Manufacturing Capability Mapping of PBA designs (V1.2)
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EDM-D-009 Signal Integrity (V1.0)
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EDM-D-010 Power Integrity (V1.0)
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EDM-D-011 Electro-Magnetic Compatibility (V1.0)
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EDM-D-012 Mechanical Integration (V1.0)
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EDM-D-013 Thermal design of electronics (V1.0)
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EDM-D-100 Reliability Quantification (V1.2)
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EDM-D-202 Design of Electronic Medical Devices (V1.0)
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Use and implementation of cEDM DfX Guidelines

DfX
Guideline
OEM, Design and industrialisation EMS and in-house assembly PCB manufacturer
EDM-D-000 General design guidelines: high level design deployable in conceptual design phase. Good DfX practice reference for communication with customers. Background knowledge. Good DfX practice reference for communication with customers. Background knowledge.
EDM-D-001

Design and purchasing instructions for PCB laminate Implementation: design rules, purchasing instructions

  • Lead-free compatibility of PCB
  • Design-for-reliability of PCB (via fatigue)
  • PCB Quality/performance requirements
  • Solderable finish selection

Purchasing instructions for PCB

  • Lead-free compatibility of PCB
  • Design-for-reliability of PCB (via fatigue)
  • PCB Quality/performance requirements
  • Solderable finish selection

Assemby preparation and handling

  • Moisture management of PCB: storage and drying
  • Packing PCB for storage
  • PCB damage prevention in assembly and repair

Purchasing instructions for PCB laminate, customer information.

  • Lead-free compatibility of PCB
  • Design-for-reliability of PCB (via fatigue)
  • Solderable finish

Assemby preparation and handling

  • Moisture management of PCB: storage and drying
  • Packing PCB for storage
EDM-D-002

Design and purchasing instructions for components.
Implementation: Approved Components and Manufacturer's List(s)

  • Lead-free compatibility of BOM
  • Design-for-Reliability of PBA (solder joint, SIR, whisker,... )
  • Component Quality/performance requirements
  • Terminal finish selection
  • Design-for-Assembly: component aspects
  • MSL (J-STD-020/J-STD-075) and PSL definition and use for process compatibility

Purchasing instructions for components
Implementation: Approved Components and Manufacturers List(s)

  • Lead-free compatibility of BOM
  • Assessment of eliability risk of PBA (solder joint, SIR, whisker,... ): liability risks of EMS, customer feedback
  • Component Quality/performance requirements
  • Terminal finish selection
  • Assembly preparation and handling
  • Moisture management of components: storage and drying.
  • J-STD-020/J-STD-075.
  • Reflow profile and wave soldering process set-up
  • BOM damage prevention: check for lead-free soldering incompatibility, soldering/cleaning limitations. PSL (J-STD-075)
  • inspection instructions
Background info
EDM-D-003

Design (material selection, design-for-cleaning) and assembly instructions
Implementation: Design rules, Assembly instructions

  • RoHS, SnPb, lead-free alloy selection
  • Design-for-Reliability of PBA (alloy selection,mixed alloys, SIR, thermal mismatch)
  • Assembly material quality/performance requirements

Assembly material selection, qualification and handling
Implementation: Qualification, Purchasing, Process and production floor management instructions

  • RoHS, SnPb, lead-free alloy selection
  • Reliability risk mitigation of PBA (alloy selection,mixed alloys, SIR, thermal mismatch): select safe materials even if they "solder not as well".
  • Assembly material quality/performance requirements
  • Assembly material storage and handling.
Background info
EDM-D-004

Design rules and assembly plant selection and instructions
Implementation: design rules, PBA passport, NPI release, EMS purchasing instructions

  • Automatic machine handling
  • Selection of PBA build-up and associated assembly flow
  • BOM compatibility with assembly processes
  • Component placement
  • Repair

Assembly preparation
Implementation: Assembly preparation instructions , methods and tools.

  • Identification of assembly flow
  • BOM & layout process compatibility check
  • Reflow profile and wave soldering process set-up
  • Component collection, machine assignment,...
  • Assembly cost estimation
Background info
EDM-D-005

Design rules and PCB plant selection and instructions
Implementation: design rules, PBA passport, NPI release, PCB purchasing instructions.

  • PCB build-up
  • Selecting optimal PCB density
  • class: minimization of cost and complexity.
  • Cu thickness
  • Selecting design matched PCB supplier using density classes.
  • Criteria for selecting advanced PCB technologies
  • Quality and reliability risks of advanced technologies
  • PCB build-up nomenclature

PCB plant selection and instructions
Implementation: PBA passport, PCB purchasing instructions.

  • Selecting design matched PCB supplier using density classes.
  • Quality and reliability risks of advanced PCB technologies: risk assessment.
  • PCB build-up nomenclature
  • Input for solder process and repair set-up

PCB manufacturing capabilities, customer support
Implementation: nomenclature, technical capacity identification.

  • Communication of technical capabilities
  • Quality and reliability risk assessment and related customer communication
EDM-D-006

Layout rules
Implementation: footprint library, layout rules, design checks

  • Footprint design basics for BGA, QFN,...
  • Thermal relief
Design check
Implementation: DfM check
Design check
Implementation: DfM check
EDM-D-007

Assembly risk assessment, quality and yield prediction, Design-for-Test.
Implementation: Test strategy development instructions, DfM/DfT evaluation, NPI release

  • Quality quantification methodology
  • Test coverage quantification
  • Test strategy development basics
  • DfT guidelines for production test and inspection
  • Quality, Test and Non-quality cost prediction

Assembly risk assessment, quality and yield prediction, Test strategy set-up.
Implementation: Test strategy development instructions, manufacturability and testability assessment, cost estimation method

  • Quality quantification methodology
  • Test coverage quantification
  • Test strategy development basics
  • Quality, Test and Non-quality cost prediction
  • Customer communication and quotation
Background info
EDM-D-008
  • Identification of technology, manufacturing and test capability needs for PCB and PBA: PBA Passport.
  • Design-for-X evaluation.
  • Cost, quality, reliability and supply risk assessment.
  • PCB supplier selection and qualification.
  • PBA assembly selection and evaluation.
  • Assembly capability mapping.
  • PBA design assembly analysis and quotation.
  • Assembly preparation.
  • Customer communication.
  • PCB manufacturing capability mapping.
  • PCB manufacturing analysis and quotation.
  • Manufacturing preparation.
  • Customer communication.
EDM-D-009 Design guidelines to guarantee signal integrity on PBA. Background info Clarification of PCB layout
EDM-D-010 Design guidelines to guarantee power integrity on PBA. Background info Clarification of PCB layout
EDM-D-011 Design guideline to guarantee Electro-Magnetic Compatibility in a system. Background info Clarification of PCB layout
EDM-D-012
  • Understanding impact of vibration and PBA fixation on PBA reliability.
  • Vibration load assessment
  • Guidelines for pre-layout fixation point and stiffner location
Background info Background info
EDM-D-013 Thermal design of PBA in a system. Clarification of PBA build-up: heat sinks Clarification of PBA build-up: heat sinks
EDM-D-100 Reliability quantification, assessment and lifetime prediction. Basis of reliability risk assessment of delivered products. Assessment of stress screening (e.g. burn-in) relevancy.  Background info
EDM-D-202 Basic design aspects for medical devices to be CE (EU) or FDA (USA) certified. Basic design aspects for medical devices to be CE (EU) or FDA (USA) certified. Basic design aspects for medical devices to be CE (EU) or FDA (USA) certified.