Partner Events

A Reality Check of Technologies for IoT Connectivity

Thursday, November 8, 2018

In this workshop we will present the latest advances related to long range IoT & LPWAN (NB-IoT, LoRa, Sigfox, IEE802.15.4g, IEEE802.11ah, …) communication.

The focus will be on practical results that have been demonstrated with IoT devices in diverse application domains.

Some highlights include the following:

  • hands-on experience with NB-IoT
  • LPWAN network-based localization: which accuracies can we expect?
  • energy consumption of IoT devices with LPWAN connectivity

Several innovations will be (live) demonstrated during a guided tour.

The workshop is open to all players in wireless technology, from technology providers and system integrators, to providers and end-users of solutions for IoT applications.

Wednesday, November 7, 2018 to Thursday, November 8, 2018

Op 7 november 2018 vindt het D&E Event plaats in Technopolis te Mechelen. Ontmoet hier ontwikkelaars en toepassers van embedded systems, ontdek de laatste technologieën en wissel visies en ervaringen uit met vakgenoten.
Specifieke thema’s tijdens dit event zijn FPGA, Security, Internet of Things, Electronic Design & Production en Embedded.

cEDM contribution:

Title: Predictive New Product Introduction for Smart Products
Abstract: Smart products that build-up the Internet of Things are often highly innovative and mandate a short time-to-market. A traditional product development approach applying experience based (conservative) design rules and extensive qualfication tests is obsolete. A smart New Product Introduction methodology is required “to go where no-one has gone before”. A high level of predictive power regarding manufacturability, supply chain readiness, quality and reliability, cost, etc. is demanded from an agile New Product Introduction methodology for Smart Products. Science allows us to predict that what we have never experienced before. The basic elements of such a science-based Predictive NPI approach – technology qualification, quality and reliability physics and virtual prototyping – will be presented as well as its practical implementation.

Best practices toward robust sensing & control of your system

Wednesday, June 20, 2018

The Mechatronica 4.0 project aims to help Flemish companies to put the Industry 4.0 philosophy into practice. Sensing and control technology will be a key feature of the next generation of autonomous, safety and inspection systems, and it is the focus of our next Mechatronics 4.0 Masterclass. The aim of this masterclass is to inform you about the possibilities of sensing and control systems, to provide you insights into how to integrate these systems into products or production systems and how to develop them in an effective way.

Typical questions that will be addressed during the masterclass:

  • Which control technique fits my application?
  • What can learning control add to my product?
  • Which hardware and toolchain can I use to develop my system?
  • How do I put model-based control design into practise. In addition, the Mechatronics 4.0 project members will present their views on sensing and control technology, which enable the realisation of smart, adaptive products. The different themes will be illustrated with industrial use cases.

 More info

Make your product future proof!

Thursday, May 17, 2018

Advanced Engineering is een gloednieuw event voor de creatie en de vervaardiging van vernieuwende producten.

Alle aspecten komen aan bod: ontwerp, engineeringsproces en prototyping, materialen en componenten, alsook connectiviteit.

Advanced Engineering, dat zijn twee vliegen in één klap: een gratis beurs met meer dan 100 standhouders die u helpen om uw producten klaar te maken voor de toekomst in combinatie met een krachtig congres met meer dan 50 topsprekers.

Ontmoet meer dan 100 standhouders, experten en pioniers die helpen om uw producten future-proof te maken. Want sparren met collega's uit andere sectoren helpt echt!
Update uw kennis tijdens het uitgebreide congres met meer dan 50 sprekers.
Ontdek een groot aanbod aan hoogtechnologische staaltjes tijdens de Experience tour
Verbreed uw netwerk met experten uit de smart electronics industrie tijdens het DSP Valley Matchmaking Event
Ga mee op exclusief bezoek bij Volvo Car Gent 

cEDM contribution:

Title: New Product Introduction methodology for reliable smart products
Abstract: Smart products are often deployed in significant numbers in an always connected and active network. Therefore, the availability and operationability of the smart application depends critically on the reliability of the build-in electronics. The smart products are often highly innovative and mandate a short time-to-market. A traditional product development approach applying (conservative) design rules and extensive qualfication tests based on field experience is obsolete. An agile New Product Introduction methodology is required. The basic elements of such an NPI approach - Physics-of-Failure, science based technology qualification and virtual prototyping - will be presented.

Can electronics sense its own health?

Thursday, March 29, 2018

In the frame of the preparation of an SBO (‘strategisch basisonderzoek’) project proposal, we would like to invite industrial research and technical experts in the field of electronics design to support us in defining the research objectives and end goal(s) of the project.

The project lies in the field of Prognostic Health Monitoring (PHM) for electronic systems. PHM is a key enabling technology where the extent of degradation is monitored in a self-learning electronic system providing early warning of failure and a Remaining Useful Life time estimation. The solution we aim for is based on a hybrid approach. On one side, we add sensors to the systems that are measuring direct or indirect physical degradation of the system. On the other side, all relevant electrical and mission profile data is collected over time and leads to self-learning systems able to predict their own health, or the health of similar systems elsewhere in the field.

It is obvious that this is an extremely challenging objective and that the project needs focus to be realistic within the budget and time restrictions. We also aim for project results that are relevant and useful for the local industry at the end of the project, allowing for implementation in your technologies. Logical next steps for industrial valorisation after the SBO project are O&O (Onderzoek en Ontwikkeling) projects.

Discover why, discover how

Wednesday, November 15, 2017


Developing a custom ASIC offers many compelling advantages. For some it is adding smarts to make a device more compelling; for others, it’s integrating a CPU and discretes onto a chip to reduce bill-of-material cost, footprint, and improve performance or protect IP. The custom ASIC process has become a much less costly and risky proposition over the last two decades. “Easy access” and “cost-effective” tools, services and IP enable development of a custom ASIC more easily and with a much lower risk.

Arm, imec.IC-link and Mentor are world leaders in the ASIC ecosystem and have joined forces to deliver a seminar for designers, engineering directors & managers and product managers to understand the latest options to deliver a product based on a custom ASIC.

The seminar will demystify the risks, explain options and explore supply chain partnership.

Wednesday, October 11, 2017 to Thursday, October 12, 2017

On the 12th of October 2017 the 19th edition of the Design Automation & Embedded Systems Event takes place at 1931 Congrescentrum Brabanthallen in Den Bosch. Due to growing demand from visitors and exhibitors the first edition in Belgium will be organised this year on October 11th 2017 at Technopolis, Mechelen. This annual event allows developers and applicants of embedded systems to enrich their knowledge and share the latest technologies and visions with peers. There is focus in the conference program and at the trading area to specific themes: “Internet of Things, Electronic Design /Production and Embedded design challenges”. Exhibitors inform visitors about possible improvements in the field of hardware, software and testing.

cEDM contribution:

Title: Reliability of electronics: a Physics-of-Failure based system approach
Abstract: A typical Printed Board Assembly may contain up to a few thousand components and ten times as many interconnections. Therefore, assessing the reliability of a PBA is not straigthforward. The traditional approach suffers from a few fundamental flaws especially the assumption of a constant failure rate. Physics-of-Failure (PoF) analysis provides quantified models for failure modes such as solder joint fatigue and capacitor degradation. Unfortunately, analyzing even a simple PBA with PoF is a challenge. In this presentation, the basic steps of a comprehensive PoF analysis of a PBA are discussed as well as a pragmatic way of gradual implementation.

How do companies tackle technological hurdles?

Thursday, September 28, 2017

During this Seminar Day, engineers, researchers and R&D managers from the manufacturing industry will come together to learn more about the results of some of our recent projects. In 3 parallel sessions, project managers and industrial partners will elaborate on their newly acquired knowledge and on concrete cases that help companies to innovate.

Each track has its own focus.

Track 1 digs deeper into the re-conception of product development processes and joining technologies for new (multi-)materials.
Track 2 develops Model Based System Engineering (MBSE), for intelligent development methods allowing interim virtual design validation.
Track 3 combines 3 very diverse projects, providing insights in new production technologies, learning control and sensor monitoring. 
At the start of every session, you can chose which track to follow and you can join as many sessions as you want. 

cEDM contribution:

Title: PoF qualification: physical & virtual testing of electronic components and systems
Abstract: Before electronic systems can be launched on the market, they must pass qualification tests according to international standards and customer-specified test programmes. Thermal and mechanical environmental loads are major causes for electronic system failures that also appear during these qualification tests. It is obvious that any failure detected in such tests is very expensive in terms of time and cost. Performing physical & virtual testing allows to find possible weak spots in the system in an early development phase when adaptations are still easy to make. In this seminar, we will show several examples on how reliability testing and simulation are used to test the electronic components and systems from a thermal and mechanical point of view.

Funding, Growing, and Exiting Semiconductor Startups in Europe

Wednesday, September 27, 2017

European start-ups have traditionally been a tremendous source of innovation in the semiconductor industry. However, two major difficulties limit their technological and business impact on the global market: raising capital and obtaining specific start-up support.

The Conference is the meeting place for start-ups, strategic investors, financial investors and everyone else who cares about the future of semiconductor and technology innovation in Europe. Our speakers will share their personal experiences in financing, IPO and acquisition exits for startups, as well as discussing the most promising areas of innovation in the European and global semiconductor ecosystem.

Emerging Technologies

Tuesday, June 27, 2017 to Wednesday, June 28, 2017

Meet and Learn from the Best Experts and Stakeholders in Your Industry

This forum will bring together industry key decision-makers, insightful experts and thought-leaders for a unique gathering to share experience and enjoy the ultimate networking opportunities. Come and network with engineers, business leaders, and visionaries — as well as the leading industry experts and European electronics designers, suppliers and users — who are shaping the future of electronics manufacturing.

Some of your industry's leading players are waiting for you:

  • Airbus
  • Robert Bosch GmbH
  • Plexus
  • NPL
  • Safran
  • IMEC

Fascinating Programme and Speakers

The IPC Reliability Forum programme features interesting and relevant speakers with sessions that will offer powerful insights on inspiring others, maximising a team’s talent. The format will allow attendees to learn and share their experiences. The programme follows the process of product realisation, from design through final testing. We will focus on best practices for working with innovative processes and new materials and equipment.

Düsseldorf, a key location for the IPC Reliability Forum

Take advantage of this opportunity to be at the heart of Europe exploring one of the fastest growing segments within the electronics industry. Experience the benefits of joining this important European electronics environment.

Click here for more information.

cEDM contribution:

Title: Physics of Failure based quantification of life time for electronics board assemblies
Abstract: To avoid electronics hardware failures during qualification or even worse, in the field, it is of high interest to perform a life time prediction of electronic assemblies in a virtual testing environment through modelling and simulations. Crucial elements in the simulation environment are the Physics of Failure (PoF) models which are translating actual loading into a wear-out life time prediction. In this presentation, we will show the PoF model approaches for the major failure mechanisms (solder fractures, Al capacitor failure, plated through hole copper via fatigue) applied to practical applications.