The 'Delamination Calculator' calculates the number of lead-free solder cycles to cohesive delamination for a PCB applying a specific laminate type. An IPC-9631 and IPC-TM-650 2.6.27 based assembly simulation reflow profile with a peak of 260° C is used as a reference profile. It uses a selection of the laminate thermal properties (Td, T260, T288, T300) for the delamination calculation and calculates the missing thermal properties.

This version also allows you to calculate the decomposition at an elevated temperature, TGA curve for a certain heating rate, time to delamination at a certain temperature and has the possibility to load the laminate properties from our PCB Laminate Overview.

Members and partners can download a member demo version of the calculator for free from the website.

A full version is also for sale. For more information please contact us.

More information on membership / partnership