cEDM WORKSHOP # 20

Better quality parts lead to faster and more cost efficient assembly and less test failures and repair. Together with quality manufacturing and assembly processes they lead to a quality product with low field failure, low maintenance, a happy customer and a healthy bottom line if the cost of “quality” is limited. Quantifying part and production cost is rather straight-forward but how can the quality of components, parts and the end product be quantified to be compared with it? An how can we predict quality to prevent quality issues?

Geert Willems, cEDM, will present the basics of quality quantification methods applicable to Printed Board Assemblies (PBA), mechatronic assemblies and processed products such as mechanical parts and Printed Circuit Boards.

cEDM Partner ASML has introduced the quality quantification (ZHDR) methodology in their product development and supply chain management. Dick Van Hees, MoVIP project leader, presents their overall approach. The multitude of improvement opportunities the methodology initiates when applied to PBA and complete, highly complex mechatronic systems development, assembly and supply will be revealed.

Next to quality efficient, low cost production is essential for a competitive product. The Bill-of-Material (BOM) composition and layout of a PBA has a determining impact on the PCB manufacturing and assembly cost. Boris Leekens, cEDM, will present the new BOM-based assembly flow model and its use as a Design-for-Assembly tool.