Publications
Publications 2016
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GENEES Guideline (October 2016)
Guideline: Best Practices for Electronics in Medical Devices (V1.3)
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International Conference on Electronics Packaging (ICEP) 2016 (April 2016)
Publication: How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance
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Eurosime (IEEE) conference 2016 (April 2016)
Publication: Four-point bending cycling as alternative for Thermal cycling solder fatigue testing
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SPM Magazine (March 2016)
Publication: Center for Electronics Design & Manufacturing
Publications 2015
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Eurosime (IEEE) conference 2015 (April 2015)
Publication: Impact of Solder-Joint Tilting on the Reliability of LED-based PCB Assemblies: A Combined Experimental and FEM Analysis
Publications 2014
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Going Green CARE Innovation 2014 (November 2014)
Publication: Material Identification in Electronics
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ESA 5th electronic materials, processes and packaging for space workshop (May 2014)
Publication: Reduced 2nd level solder joint life time of low-CTE mold compound packages
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Eurosime (IEEE) conference 2014 (April 2014)
Publication: Hidden Head-in-Pillow soldering failures
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Global SMT & Packaging (April 2014)
Publication: New brittle fracture test reveals importance of choosing the right board finish
Publications 2013
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EDN Network website (November 2013)
Article: Strategies for Recycling Electronic Devices — Europe leads again
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imec e-newsletter (September 2013)
Article: Efficient recycling of electronics
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EMPC (IMAPS) Conference (September 2013)
Publication: Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode
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EMC Europe (September 2013)
Publication: Modeling the Low- and High-Frequency Impedance of Thermal Reliefs
Publications 2012
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ESTC Conference (September 2012)
Publication: Early fatigue failures in Copper wire bonds inside packages with low CTE Green Mold Compounds
Publications 2011
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EPTC Conference (December 2011)
Publication: Green Mould Compounds: Impact on Second Level Interconnect ReliabilityYou need to be registered and logged in to download this publication. You can register for free here.Article: Chip Design website
Article: Printed Circuit Design & Fab website
Article: PCB Circuit Boards website
Publications 2010
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Global SMT & Packaging (September 2010)
Publication: Predicting PCB delamination in lead-free assembly
RoHS Service
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RoHS Service Brochure
De RoHS-richtlijn: een antwoord op uw vragen (NL)
La directive RoHS: une réponse à vos questions (FR)
The RoHS directive: an answer to your questions (EN)
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Interconnect 24 (July 2007)
Publication: RoHS: De controles (NL)
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Interconnect 22 (October 2006)
Publication: RoHS-richtlijn Wetgeving maakt investeringen onzeker (NL)
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Interconnect 21 (June 2006)
Publication: Het RoHS-zakwoordenboek: gratis handleiding voor problemen met loodvrij (NL)
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Industrie Technisch Management (June 2006)
Publication: Vrijwillig loodvrij produceren (NL)
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Industrie Technisch Management (May 2006)
Publication: Loodvrij solderen, erger dan de Y2K problematiek (NL)
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Interconnect 20 (February 2006)
Publication: Loodvrij: het management moet mee (NL)
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Interconnect 19 (October 2005)
Publication: Aanspreekpunt Loodvrij Solderen (NL)